SSMC participated in 2014 21st IPFA conference
On 02-04 July, our Product and Test Engineering Failure Analysis (PTE FA) expert, Seah Pei Hong, represented SSMC to present in the 2014 21st International Symposium on the Physical & Failure Analysis of Integrated Circuit (IPFA) conference in Marina Bay Sand, Singapore. Her paper title is “Application of Scanning Capacitance Microscopy on SOI Wafer in Die-level Failure Analysis”. Also, another SSMC PTE FA engineer, Chng Kheaw Chung participated in "Art of FA photo contest", and won 3rd prize with his “White Christmas” FA photo.